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Self-encapsulated DC MEMS switch using recessed cantilever beam and anodic bonding between silicon and glass
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Self-encapsulated DC MEMS switch using recessed cantilever beam and anodic bonding between silicon and glass
Journal
Microsystem Technologies
Date Issued
2021-03-01
Author(s)
Behera, Bhagaban
Dhanekar, Saakshi
Singh, Gurpartap
Chandra, Sudhir