Polymer Dielectrics for Electronic Packaging: Curing Dynamics of an Epoxy Resin Blend

Date Issued
2024-01-01
Author(s)
Saraswati, Siddharth
Arora, Deepak
DOI
10.1109/EDTM58488.2024.10512252
Abstract
A blend of epoxies, with an amine-based hardener, was cured at different rates between 1 and 20 K/min. The effect of heating rate (β) during curing on the glass transition temperature (T_g), peak curing temperature (T_p) and relative degree of cure (αR) are reported. A heating rate of 7 K/min results in the maximum degree of cure and the highest T_g(>300 °C).
Subjects